ACF |
Advanced Ceramics Facility |
AMI |
Advanced Multilayer Interconnect |
BGA |
Ball Grid Array |
COB |
Chip On Board |
COF |
Chip On Flex |
CPW |
Coplanar Waveguide |
CS(P) |
Chip Scale (Packages) |
CTE |
Coefficient Of Thermal Expansion |
CTTE |
Close To The Edge Technology |
DCB |
Direct Copper Bond |
DF |
Dissipation Factor |
DFM |
Design for Manufacturability |
DIP |
Dual Inline Packaging |
DMMA |
Duplex Metal-Metalloid Alloy |
ESD |
Electrostatic Discharge |
FC |
Flip Chip |
FCB |
Flip Chip Bonding |
FCOB |
Flip Chip On Board |
FLDCC |
Fine Pitch Leaded Chip Carrier |
GGI |
Gold To Gold Interconnect |
HDI |
High Density Interconnect |
HDP |
High Density Package |
HTCC |
High Temperature Cofired Ceramic |
IMAPS |
International Microelectronics And Packaging Society |
IPC |
Integrated Passive Components |
IR |
Insulation Resistance |
k |
Dielectric Constant |
LGA |
Land Grid Array |
LIV |
Low inductance via |
LTCC |
Low Temperature Cofired Ceramic |
LTFC |
Low Temperature Firing Ceramic (LTCC) |
MCIC |
Multilayer Ceramic Integrated Circuit |
MCM |
Multi-Chip-Modules |
MCM - C |
Cofired Ceramic, thickfilm |
MCM - D |
Deposited Thinfilm |
MCM - L |
Laminated Printed Wiring Board (FR4, PCB, PTFE) |
MCOF |
Microwave Chip On Flex |
MCP |
Multi-Chip-Packages |
MIB |
Multilayer Interconnect Board |
MLC |
Multilayer Ceramic (for LTCC and HTCC) |
MLTF |
Multilayer Thin Film |
MMS |
Micro Module System |
MS |
Microstrip |
PCB |
Printed Circuit Board |
PCL |
Photoprintable Conductor on LTCC |
PGA |
Pin Grid Array |
PQFP |
Plastic Quad Flat Pack(age) |
PTF |
Polymer Thick Film |
PWB |
Printed Wiring Board |
QFP |
Quad Flat Package |
RLC |
Resistor, Inductor & Capacitor |
SBB |
Stub-Bump-Bonding |
SLAM |
Single Layer Packages |
SMT |
Surface Mount Technology |
SRF |
Self-Resonant Frequency |
S/B |
Side Brazed |
TCE |
Thermal Coefficient Of Expansion |
TFBGA |
Thin Film Ball Grid Array |
TFMSL |
Thin Film Microstrip Line |
TOS |
Tape On Substrate |
ZST |
Zero Shrink Tape |