名词缩写

ACF Advanced Ceramics Facility AMI Advanced Multilayer Interconnect
BGA Ball Grid Array COB Chip On Board
COF Chip On Flex CPW Coplanar Waveguide
CS(P) Chip Scale (Packages) CTE Coefficient Of Thermal Expansion
CTTE Close To The Edge Technology DCB Direct Copper Bond
DF Dissipation Factor DFM Design for Manufacturability
DIP Dual Inline Packaging DMMA Duplex Metal-Metalloid Alloy
ESD Electrostatic Discharge FC Flip Chip
FCB Flip Chip Bonding FCOB Flip Chip On Board
FLDCC Fine Pitch Leaded Chip Carrier GGI Gold To Gold Interconnect
HDI High Density Interconnect HDP High Density Package
HTCC High Temperature Cofired Ceramic IMAPS International Microelectronics And Packaging Society
IPC Integrated Passive Components IR Insulation Resistance
k Dielectric Constant LGA Land Grid Array
LIV Low inductance via LTCC Low Temperature Cofired Ceramic
LTFC Low Temperature Firing Ceramic (LTCC) MCIC Multilayer Ceramic Integrated Circuit
MCM Multi-Chip-Modules MCM - C Cofired Ceramic, thickfilm
MCM - D Deposited Thinfilm MCM - L Laminated Printed Wiring Board (FR4, PCB, PTFE)
MCOF Microwave Chip On Flex MCP Multi-Chip-Packages
MIB Multilayer Interconnect Board MLC Multilayer Ceramic (for LTCC and HTCC)
MLTF Multilayer Thin Film MMS Micro Module System
MS Microstrip PCB Printed Circuit Board
PCL Photoprintable Conductor on LTCC PGA Pin Grid Array
PQFP Plastic Quad Flat Pack(age) PTF Polymer Thick Film
PWB Printed Wiring Board QFP Quad Flat Package
RLC Resistor, Inductor & Capacitor SBB Stub-Bump-Bonding
SLAM Single Layer Packages SMT Surface Mount Technology
SRF Self-Resonant Frequency S/B Side Brazed
TCE Thermal Coefficient Of Expansion TFBGA Thin Film Ball Grid Array
TFMSL Thin Film Microstrip Line TOS Tape On Substrate
ZST Zero Shrink Tape